2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation

2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation

Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. Heatsink Exteral Size: 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm. Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc. Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation. Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating. Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.

Copper heatsink is a popular thermal management option among electronic devices because of its capacity to absorb heat relatively quickly. 

Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. 

It is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to air, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. 

Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc.

Spesification: 

Material: Pure Copper

Processing method: Skiving fin

Finishing: Antioxidant treatment

Exteral Size:  1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm

Bottom Thickness: 0.12"/ 3mm

Copper Fin Thickness: 0.02"/ 0.4mm

Package Included: 

2 x Copper Heatsink