Reballing & Tinning Stencil for Cell Phone CPU - Precision-Cut Stainless Steel Stencil Compatible with S21 & S21 Ultra

Reballing & Tinning Stencil for Cell Phone CPU - Precision-Cut Stainless Steel Stencil Compatible with S21 & S21 Ultra

[Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners. [Applicable CPU] This CPU reballing stencil is applicable for Snapdragon 888, for for xyn2100 CPU. [ Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency. [Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature will not easily deform. [Suitable Model] This reballing template is suitable for S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones. Specification:
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For Snapdragon 888, for for xyn2100 CPU
Applicable : For S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc.

How to Use:
Use directly.

Package List:
1 x BGA Reballing Stencil