UL94-V0 Thermally Conductive Silicone Encapsulating and Potting Compound Heat-Resistant,High Thermal Conductivity,Seal,Mask,Waterproof & Insulate

UL94-V0 Thermally Conductive Silicone Encapsulating and Potting Compound Heat-Resistant,High Thermal Conductivity,Seal,Mask,Waterproof & Insulate

Selectable Thermal Conductivity: The Ausbond compound offers excellent thermal conductivity, with options ranging from 0.8 W/M.K to 3.3 W/M.K, allowing customers to select the level of heat dissipation needed for their specific applications. UL94V0 Flame Retardant Certification: This Ausbond Flame-Retardant Thermally Conductive potting compound meets the stringent UL94V0 flame retardant standards, ensuring safety and compliance for electronics that require protection against fire hazards. Flexible Curing Options: The Ausbond High Thermal Conductivity Electronic Grade Potting Compound can be cured at room temperature or through heat curing, with the curing process accelerated by higher temperatures, making it suitable for various production environments. Intermediate Hardness: Once cured, the Ausbond Flame-Retardant Thermally Conductive Electronics Potting Glue is harder than standard silicone potting adhesives but softer than epoxy resin potting adhesives, providing a balance of protection and flexibility. Chemical Resistance: The cured material exhibits excellent resistance to acids and alkalis, safeguarding the encapsulated electronics from harsh chemical environments.Ausbond Flame-Retardant Thermally Conductive Electronic Potting And Encapsulation Waterproof and Insulating: The Ausbond High Thermal ConductivityElectronic Potting Compound provides waterproof sealing and insulation, making it ideal for applications where moisture protection and electrical isolation are necessary. Temperature Resistance: With excellent resistance to both high and low temperatures, ranging from -60℃ to 200℃, the compound is suitable for electronics used in extreme temperature environments.Ausbond Flame-Retardant Thermally Conductive Electrical Silicone Potting Compound High Voltage Resistance: Capable of withstanding voltages up to 25Kv/mm, the Ausbond Waterproof Electrical Potting Compound is ideal for applications where electrical components need to be protected from voltage fluctuations. Superior Waterproofing: The Ausbond High Thermal Conductivity Flexible Potting Compound For Electronics offers a superior waterproof effect, ensuring that the encapsulated electronics remain dry and functional in wet conditions. Wide Range of Applications: The Ausbond Thermally Conductive Silicone Encapsulating and Potting Compound is widely used in automotive electronics, HID lighting, power supply modules, sensors, circuit boards, transformers, and amplifiers, making it a versatile solution for products that require heat dissipation, flame retardancy, and high-temperature resistance.

Ausbond 192g Is A Kind Of Addition-Type Double-Component Organic Silicon Heat Conduction Gel With Low Adhesive, Which Can Be Cured At Room Temperature Or By Heat With The Feature That The Higher The Temperature Is The Faster Cure Speed Is.

This Product Will Not Create Any By-Product In The Process Of Curing Reaction, Which Can Be Used For The Surface Of Pc, Abs, Pvc Materials And Metal.The Flame Retardancy Can Up To The Level Of Ul94-V0.

It Can Conform To The Requirements Of Eu Rohs Directive Completely.

It Is Widely Used For The Products, Which Have The Requirement Of Heat Dissipation, Flame Retardancy And High Temperature, Such As Automobile Electronics, Hid, Power Module, Sensor, Circuit Board, Transformer And Amplifier.

Thermal Conductivity From 0.8 W/M.K To 3.3 W/M.K Is Available.