Chip Quik WS991SNL35T4 Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (35g syri

Chip Quik WS991SNL35T4 Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (35g syri

Solder Paste Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble Lead-Free SAC305 in 35g/10cc syringe with plunger and tips. Revolutionary Formula: No Refrigeration Required! Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic Water-Soluble Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow) Metal Content: 86% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217C (423F) Size: 35g/10cc syringe Shelf Life Refrigerated >6 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.